Improving the efficiency of power is the key issue. We focused on power consumption of electronic devices and invented TSI to visualize the thermal characteristics of the devices. Because Diamond and DLC are high in thermal conductivity, they used as heat dissipater. How to evaluate the thermal characteristics of these devices are very important. The physical contact of these heat dissipating devices and the other devices are also very important. We intended to evaluate how the physical contact influences the thermal characteristics of the devices.
Non Destructive Inspection with thermal images
Visualized the heat increase with physical defects.
Visualized the copper wire with high heat dissipation.
A contact states of a graphite sheet and diamond
Poor contact generates a temperature rise!